1st October 2018: The Global Thin
Wafer Market is expected to witness significant growth over the
forecast period owing to increasing demand for electronic devices with high on
performance, low on cost and small in size. Rising demand for semiconductor
devices in end use industries such as consumer electronics, automotive and
telecommunication, increasing adoption of portable devices, and growing demand
of 300mm wafer are few other factors anticipated to propel the market growth
over the next seven years.
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A
wafer is a substrate or slice of semiconductor material which is mainly used in
photovoltaic solar cells and in electronics for the fabrication of integrated
circuits. It undergoes several micro fabrication process steps such as ion
implantation or doping, deposition of various materials, etching and
photolithographic patterning. Thin/Ultra-thin wafers have various industrial
uses such as advanced packaging applications (TSV, interposers, and Fan out
WLP), LEDs, power devices, CIS, memory, and RF devices. The growing demand for
aforementioned uses has anticipated the market to witness significant growth by
2022.
Growing
need of thin wafer semiconductors, rising technological advancements, and
growing demand for material savings projected to drive the market over the next
seven years. However, thin wafer’s high volatility and susceptibility to damage
under stress make it anticipate slightly low growth over the next seven years.
The primary reason for the market to expect aforementioned challenges is owing
to growing demand of ultra-thin wafer thus making them prone to damage under
cracking. The companies have formed a support system which through continuous
R&D endeavors is working to develop a stronger thin wafer dies. These
developed dies are expected to assist in reducing the thickness of packaged
dies for mobile phones and in providing the efficient thermal management to
electronic devices.
Market Segment:
The major manufacturers covered in this
report
•
LG Siltronic
•
Shin-Etsu Chemical
•
Siltronic AG
•
SUMCO Corporation
•
SunEdision Semiconductor
•
SUSS MicroTec AG
•
Lintec Corporation
•
DISCO Corporation
•
3M
•
Applied Materials
•
Nissan Chemical Corporation
•
Synova
•
EV Group
Geographically, this report studies the
top producers and consumers, focuses on product capacity, production, value,
consumption, market share and growth opportunity in these key regions, covering
•
North America
•
Europe
•
China
•
Japan
•
Other Regions
On the basis of the end
users/applications, this report focuses on the status and outlook for major
applications/end users, consumption (sales), market share and growth rate for
each application, including
•
MEMS
•
CMOS Image Sensors
•
Memory
•
RF Devices
•
LEDs
•
Interposers
•
Logic
Key Stakeholders
•
Thin Wafer Manufacturers
•
Thin Wafer Distributors/Traders/Wholesalers
•
Thin Wafer Subcomponent Manufacturers
•
Industry Association
•
Downstream Vendors
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